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VERSION:2.0
PRODID:-//Convention Housing//Events//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:occ-eventseye-31513-2027-05@convention-housing.com
DTSTAMP:20260617T140038Z
DTSTART;VALUE=DATE:20270512
DTEND;VALUE=DATE:20270515
SUMMARY:IC & SENSOR PACKAGING EXPO JAPAN - OSAKA
DESCRIPTION:Asia’s Leading Exhibition for IC Final Manufacturing gathering Advanced Equipment\, Materials and Services. Assembly Equipment\, Packaging Materials / Equipment\, Analysis/Simulation Software for IC Packaging...\nEvent website: http://www.nepconjapan.jp/osaka/ja-jp.html\nEvent details: https://www.convention-housing.com/events/ic-and-sensor-packaging-expo-japan-osaka-2027-05-31513
LOCATION:Intex Osaka - Osaka\, Japan
URL:https://www.convention-housing.com/events/ic-and-sensor-packaging-expo-japan-osaka-2027-05-31513
END:VEVENT
END:VCALENDAR